Wafers Process Grinding
We will make it to the final thickness! A slight change can have a big impact.
We would like to introduce our wafer process "Grinding" in semiconductor manufacturing. After slicing, the wafer is ground to remove burrs and surface contaminants, achieving the final thickness of the wafer. The Dubrin rotary union ensures a uniform grinding allowance during the process, while the Dubrin water rotary union keeps the grinding surface at a low temperature. [Features] - The Dubrin rotary union guarantees a uniform grinding allowance during the process. - The Dubrin water rotary union maintains a low temperature on the grinding surface. *For more details, please refer to the related links or feel free to contact us.
- 企業：デュブリン・ジャパン・リミテッド 本社
- 価格：Other
